发明名称 |
Method of making semiconductor packages at wafer level |
摘要 |
A method of manufacturing chip scale packages at wafer level, comprising the steps of: a) providing a wafer having an active and a back side surface, the active surface of the wafer having a plurality of scribe lines defining individual chips, and each chip having a plurality of electrodes; b) forming a dam enclosing the perimeter of the wafer; c) filling the area enclosed by the dam with molding compound to encapsulate the active surface of the wafer; d) removing the dam to expose the scribe lines covered by the dam on the active surface of the wafer; and e) dicing the wafer according to the exposed scribe lines as positioning reference marks.
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申请公布号 |
US2001055834(A1) |
申请公布日期 |
2001.12.27 |
申请号 |
US20010925688 |
申请日期 |
2001.08.10 |
申请人 |
ADVANCED SEMICONDUCTOR ENGINEERING, INC. |
发明人 |
LIN CHUN HUNG |
分类号 |
H01L21/56;H01L23/31;(IPC1-7):H01L21/44 |
主分类号 |
H01L21/56 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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