发明名称 |
Coil apparatus and manufacturing method for the same |
摘要 |
In order to prevent a substrate for mounting electronic components from being damaged when cores are rubbed together during assembly, a pair of core members are respectively arranged so as to sandwich a part of a coil pattern formed on the substrate from the top and bottom sides of the substrate, and the core members are held together by a core-combining member. A cover member is arranged and fixed to the substrate so as to cover the upper side of the core-combining member. Inclined ribs on the cover member raise the core-combining member by abutting against external inclined faces of leg portions of the core-combining member so as to apply a raising force. A clearance thereby is formed between internal faces of a top bar portion of each core member and a surface of the substrate. When sliding the core member, the surface of the substrate is not contacted by the core member so as not to be damaged.
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申请公布号 |
US2001054946(A1) |
申请公布日期 |
2001.12.27 |
申请号 |
US20010885084 |
申请日期 |
2001.06.20 |
申请人 |
MURATA MANUFACTURING CO., LTD. |
发明人 |
INOUE KEIJI;ISHIGE TSUTOMU |
分类号 |
H01F27/26;H01F27/28;(IPC1-7):H01F5/00 |
主分类号 |
H01F27/26 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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