发明名称 Coil apparatus and manufacturing method for the same
摘要 In order to prevent a substrate for mounting electronic components from being damaged when cores are rubbed together during assembly, a pair of core members are respectively arranged so as to sandwich a part of a coil pattern formed on the substrate from the top and bottom sides of the substrate, and the core members are held together by a core-combining member. A cover member is arranged and fixed to the substrate so as to cover the upper side of the core-combining member. Inclined ribs on the cover member raise the core-combining member by abutting against external inclined faces of leg portions of the core-combining member so as to apply a raising force. A clearance thereby is formed between internal faces of a top bar portion of each core member and a surface of the substrate. When sliding the core member, the surface of the substrate is not contacted by the core member so as not to be damaged.
申请公布号 US2001054946(A1) 申请公布日期 2001.12.27
申请号 US20010885084 申请日期 2001.06.20
申请人 MURATA MANUFACTURING CO., LTD. 发明人 INOUE KEIJI;ISHIGE TSUTOMU
分类号 H01F27/26;H01F27/28;(IPC1-7):H01F5/00 主分类号 H01F27/26
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