发明名称 |
Production of a solid body substrate used in the silicon switching circuits comprises a cylindrical solid body and cutting out substrate plates in the direction of the cylinder axis, and laterally joining several substrate plates |
摘要 |
Production of a solid body substrate comprises preparing a cylindrical solid body and cutting out substrate plates (1, 2) in the direction of the cylinder axis; and laterally joining several substrate plates. An Independent claim is also included for a process for the production of a crystalline solid body layer comprising forming a solid body substrate as above; producing a crystalline solid body layer on the surface of the substrate; removing the crystalline solid body layer from the substrate; and carrying out the previous two steps. Preferred Features: The substrate is a silicon substrate and has crystallographic (100)-orientation.
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申请公布号 |
DE10025746(A1) |
申请公布日期 |
2001.12.06 |
申请号 |
DE20001025746 |
申请日期 |
2000.05.24 |
申请人 |
WERNER, JUERGEN H. |
发明人 |
WERNER, JUERGEN H. |
分类号 |
C30B33/00;C30B33/06;(IPC1-7):C30B33/00 |
主分类号 |
C30B33/00 |
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