| 摘要 |
<p>PROBLEM TO BE SOLVED: To solve the problem such that possibility of lowering of performance, reliability, etc., of an HAD part caused by generation of heat from the inside of a device, is very high in the case of only integrating a disk controller and a magnetic disk device, although a disk array subsystem with large capacity can be formed in a saved space by mounting the disk controller and the mag netic disk device in one frame. SOLUTION: A magnetic disk controller and the magnetic disk device are mounted in one frame and each part is cooled efficiently by high density assembly technique and high efficiency cooling structure. Thereby, the disk array subsystem of large storage capacity is realized in a saved floor area.</p> |
