PICK AND PLACE MODULE OF SEMICONDUCTOR PACKAGE MANUFACTURING EQUIPMENT

摘要

PURPOSE: A pick and place module of a semiconductor package manufacturing equipment is provided to pick and place correctly a strip for semiconductor package of various sizes. CONSTITUTION: A motor(52) having a pulley(53) is installed on a frame(51). The pulley(53) of the motor(52) is connected with a ball screw(55) by a belt(54). A limit bearing(57) is combined with the ball screw(55) by a connection block(56). A support shaft(58) is installed at a lower portion of the limit bearing(57). A fixing block(59) of a flat plate shape is combined with at a lower end of the support shaft(58). A latch(60) is installed at one side of the fixing block(59). A projection is formed at the other side of the fixing block(59). A pick and place module is fixed by the latch(60) and the projection. A cylinder is installed at the fixing block(59). A push plate of a pick and place module is pressed by the cylinder.