发明名称 |
Electronic device and process of making electronic device |
摘要 |
An electronic device and process of making the device is disclosed. The device includes a multi-sided body defined by a plurality of electrode plates arranged in a stack. A resin layer is applied to both conductive and semiconductive regions of the device, and metal is plated upon terminals to create a conductive element. The device may be a varistor, thermistor, resistor, or other microelectronic component having a multi-sided body and terminal structures that are capable of receiving a resin coating. The multi-sided body has a resin coating on at least a portion of an exterior surface, the resin coating substantially preventing plating of metal onto the exterior surface of the body. One suitable resin coating that may be employed is a thermoset resin comprising a B-staged divinylsiloxane-bis(benzocyclobutene)(i.e. "BCB") resin dissolved in mesitylene solvent.
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申请公布号 |
US2001035810(A1) |
申请公布日期 |
2001.11.01 |
申请号 |
US20010810829 |
申请日期 |
2001.03.16 |
申请人 |
HEISTAND ROBERT H.;GALVAGNI JOHN L.;MEVISSEN JEFFREY P.;KENNEDY ROBERT MOFFATT |
发明人 |
HEISTAND ROBERT H.;GALVAGNI JOHN L.;MEVISSEN JEFFREY P.;KENNEDY ROBERT MOFFATT |
分类号 |
H01C7/00;H01C1/028;H01C1/142;H01C7/04;H01C7/10;H01C17/28;H01G2/12;(IPC1-7):H01C1/02 |
主分类号 |
H01C7/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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