发明名称 METHOD FOR IMPROVING RELEASING PROPERTY OF MOLD USING PLASMA POLYMERIZATION PROCESS AND SPUTTERING PROCESS
摘要 PURPOSE: A method for improving releasing property of a mold using plasma polymerization process and sputtering process is provided to coat a polymer thin film having a high durability on the mold, wherein the mold is not contaminated by residual materials such as a release agent due to superior releasing property of the polymer thin film. CONSTITUTION: The method for improving releasing property of a mold comprises a first polymer coating step in which the mold is coated by plasma polymerizing a polymerizable gas onto a chromium or nickel plated mold in an ordinary method; a metal coating step in which a metal is coated by sputtering a target metal of chromium or nickel on the first polymer coated mold; and a second polymer coating step in which the metal coated mold is coated by plasma polymerizing a polymerizable gas. The method comprises a metal coating step in which a metal is coated by sputtering a target metal of chromium or nickel on a non-plated mold; and a metal coating step of sputtering a target metal of chromium or nickel on a metal as coating the metal by plasma polymerizing a polymerizable gas.
申请公布号 KR20010094026(A) 申请公布日期 2001.10.31
申请号 KR20000017387 申请日期 2000.04.03
申请人 LEE, BYENG CHUL 发明人 LEE, BYENG CHUL
分类号 C23C16/48;(IPC1-7):C23C16/48 主分类号 C23C16/48
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