| 摘要 |
PROBLEM TO BE SOLVED: To provide the packaging structure of a hollow structure functional element that is packaged by a method for avoiding a problem caused by a manufacturing method utilizing a die and wire bonding. SOLUTION: A functional element structure body 1a where a bump 2 and a resin film 3a are formed in a functional element 1 is aligned at the specific position of a lead frame 4 for heating, pressurizing, or the like, thus electrically and mechanically connecting the lead frame 4 to the bump 2, at the same time, carrying out the resin sealing of the lead frame 4 by penetration and bonding into the related part of the lead frame 4 by the fluxing of the resin film 3a, and hence packaging the functional element 1.
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