| 摘要 |
PROBLEM TO BE SOLVED: To provide a thermal head in which good thermal conduction characteristics can be attained. SOLUTION: A thermal head substrate 100 is bonded with a ceramic thermal conduction block 110 to which a metallic heat dissipation plate 120 is bonded. Since a conventionally required insulating means having an extremely low thermal conductivity, e.g. solder resist, for insulating the thermal head substrate electrically from the metallic heat dissipation plate is eliminated, a thermal head performing high speed printing with high image quality while exhibiting a high heat dissipation efficiency and suppressing the trailing phenomenon can be provided.
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