| 发明名称 |
METHOD OF MANUFACTURING CERAMIC THIN FILM DEVICE AND CERAMIC THIN FILM DEVICE |
| 摘要 |
PROBLEM TO BE SOLVED: To solve such a problem that, in a process of transferring ceramic thin film elements deposited on a first substrate to a second substrate, the delamination caused between the tin of a bonded member on the second substrate and the second substrate. SOLUTION: Gold is deposited as a film on the second substrate through a metal capable of ensuring adhesion, and the tin is bonded onto it. |
| 申请公布号 |
JP2001274345(A) |
申请公布日期 |
2001.10.05 |
| 申请号 |
JP20000082538 |
申请日期 |
2000.03.23 |
| 申请人 |
SEIKO EPSON CORP |
发明人 |
TAMURA HIROAKI;HASEGAWA KAZUMASA;TAKAHASHI KATSUHIRO |
| 分类号 |
C04B37/00;H01L21/8242;H01L27/10;H01L27/108;H01L41/08;H01L41/18;H01L41/22;H01L41/29;H01L41/313 |
主分类号 |
C04B37/00 |
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