发明名称 DEVELOPING TREATMENT METHOD AND DEVELOPING TREATMENT EQUIPMENT
摘要 PROBLEM TO BE SOLVED: To prevent dropping of developer from a coating liquid supply nozzle on a substrate on which the developer has been already supplied. SOLUTION: A developer supply nozzle 70 which is installed so as to move freely in the X direction in a chamber 60 begins to move from a cleaning tank 85 as a waiting position T to the positive X direction. The nozzle 70 crosses a part above a wafer W without supplying developer and stops at a position P' which proceeds a little from an end portion P of the wafer W. The nozzle 70 then moves in the reverse direction, i.e., the negative X direction while supplying developer to the wafer W. After that, the nozzle 70 stops supply of developer at a position Q' which proceeds a little from an end portion Q of a cleaning tank 85 side of the wafer W, and is returned to the cleaning tank 85.
申请公布号 JP2001274082(A) 申请公布日期 2001.10.05
申请号 JP20010012402 申请日期 2001.01.19
申请人 TOKYO ELECTRON LTD 发明人 MATSUYAMA YUJI;NAGAMINE SHUICHI;DEGUCHI MASATOSHI;TAKAMORI HIDEYUKI
分类号 G03F7/30;H01L21/027;(IPC1-7):H01L21/027 主分类号 G03F7/30
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