发明名称 Ceramic electronic component having lead terminal
摘要 <p>A ceramic electronic component includes electrodes (5a, 5b) each having a four layer structure including a first electrode layer (1a, 1b) made of an Ni-Ti alloy and constructed so as to adhere closely to the surface of a ceramic material defining a ceramic element (10), a second electrode layer (2a, 2b) made of at least one selected from the group consisting of Cu, Ag, and Au, disposed on the first electrode layer (1a, 1b), a third electrode layer (3a, 3b) made of an Ni-Ti alloy, disposed on the second electrode layer (2a, 2b), and a fourth electrode layer (4a, 4b) made of at least one selected from the group consisting of Cu, Ag, and Au, disposed on the third electrode layer (3a, 3b). Lead terminals (7a, 7b) are bonded to the electrodes having the four layer structures via solder members, respectively. &lt;IMAGE&gt;</p>
申请公布号 EP1134757(A2) 申请公布日期 2001.09.19
申请号 EP20010105906 申请日期 2001.03.09
申请人 MURATA MANUFACTURING CO., LTD. 发明人 TANIDA, TOSHIAKI;NAGASHIMA, MITSURI;YAMAOKA, OSAMU
分类号 H01G4/12;H01C1/142;H01G4/005;H01G4/008;H01G4/228;H01G4/232;H01G4/252;H01L41/047;(IPC1-7):H01G4/252 主分类号 H01G4/12
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