发明名称 |
Temperature controlled high power burn-in board heat sinks |
摘要 |
A heat sink is used for thermally controlling a chip on a burn-in board which is being tested in a burn-in oven. The heat sink includes a resiliently mounted block that will engage a chip under resilient pressure and which is housed in a separate cup that permits accommodating misalignments or shifting of the heat sink when it contacts the chip. Additionally, the block carries a temperature sensor that is resiliently loaded against a chip which the heat sink engages. A bore mounts the temperature sensor and is also connected to a source of helium to provide a layer of helium between a surface of the heat sink and the adjacent surface of the chip for modifying the thermal coupling between the heat sink and the chip.
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申请公布号 |
US6288371(B1) |
申请公布日期 |
2001.09.11 |
申请号 |
US19990351656 |
申请日期 |
1999.07.13 |
申请人 |
MICRO CONTROL COMPANY |
发明人 |
HAMILTON HAROLD E.;TREMMEL TOM A. |
分类号 |
G01R31/28;(IPC1-7):G01R35/00 |
主分类号 |
G01R31/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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