发明名称 |
Hot-melt adhesive film for implanting electronic modules into cards, e.g. telephone cards or credit cards, comprises an elastomer, a crosslinker and optionally a copolyamide |
摘要 |
<p>Adhesive film for implanting electronic modules into cards comprises 60-100 wt.% of an elastomer, 0-40 wt.% of a copolyamide and 0.1-10 wt.% of a crosslinker. An independent claim is also included for the production of such a film by mixing the ingredients, applying the mixture to a support and drying the product.</p> |
申请公布号 |
DE19948560(A1) |
申请公布日期 |
2001.08.23 |
申请号 |
DE1999148560 |
申请日期 |
1999.10.08 |
申请人 |
ATP ALLTAPE KLEBETECHNIK GMBH |
发明人 |
STEENBERGEN, JOHANNES CASPER VAN;MUELLER, JAN;MERTINKAT, JOERG |
分类号 |
C09J7/00;G06K19/077;H01L21/58;(IPC1-7):C09J133/02;H05K1/18;C09J7/04 |
主分类号 |
C09J7/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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