发明名称 Hot-melt adhesive film for implanting electronic modules into cards, e.g. telephone cards or credit cards, comprises an elastomer, a crosslinker and optionally a copolyamide
摘要 <p>Adhesive film for implanting electronic modules into cards comprises 60-100 wt.% of an elastomer, 0-40 wt.% of a copolyamide and 0.1-10 wt.% of a crosslinker. An independent claim is also included for the production of such a film by mixing the ingredients, applying the mixture to a support and drying the product.</p>
申请公布号 DE19948560(A1) 申请公布日期 2001.08.23
申请号 DE1999148560 申请日期 1999.10.08
申请人 ATP ALLTAPE KLEBETECHNIK GMBH 发明人 STEENBERGEN, JOHANNES CASPER VAN;MUELLER, JAN;MERTINKAT, JOERG
分类号 C09J7/00;G06K19/077;H01L21/58;(IPC1-7):C09J133/02;H05K1/18;C09J7/04 主分类号 C09J7/00
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