| 摘要 |
PROBLEM TO BE SOLVED: To provide a wafer prober in which the reliability of electrical connection with through-holes formed among an external terminal and an electrode and other conductors formed to the surface or inside of a stage for inspection is improved. SOLUTION: Chuck-top conductor layers 36 are formed onto the surface of a ceramic stage 12 on which a semiconductor wafer is placed, and electrodes 14, 16 are formed into the ceramic stage 12 while through-holes 20, 22 electrically connecting the electrodes 14, 16 and the external terminals 24, 26 and box holes 28, 30, into which the external terminals 24, 26 are inserted, are formed. Parts of the box holes 28, 30 are conducted electrically.
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