SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR

摘要

PROBLEM TO BE SOLVED: To realize high performance by enabling compact constitution when a semiconductor element is mounted in a package and facilitating three- dimensional arrangement constitution and mutual connection of semiconductor elements if necessary in a semiconductor device. SOLUTION: A thin semiconductor chip 40 of about 50μm in thickness is buried and mounted in a package 20. External connection terminals 32 are formed on both surfaces of the package 20, or a terminal forming part of a wiring pattern 29 with which the external connection terminals are to be connected is exposed from a solder resist layer 31 and constituted in such a manner that multilayer stacking is possible.