| 摘要 |
PROBLEM TO BE SOLVED: To provide a soldering structure which does not generates cracking at the boudary between an inside electrode and a hole inner wall of a structural body or the inner part of the structural body, has satisfactory inside electrode strength and is harmless for environments because of the leadlessness in the soldering structure provided with the inside electrode in the hole inner wall of the structural body, and a feed-through ceramic capacitor provided with such a soldering structure. SOLUTION: This soldering structure is provided with the structural body having the hole, the inside electrode formed on the hole inner wall, a lead wire which is inserted into the hole, and the leadless solder with which the hole is impregnated and the inside electrode and the lead wire are fixed. In addition, the solder is composed of an alloy which does not cause volume shrinkage at solidification.
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