发明名称 Application of vapor phase HFACAC-based compound for use in copper decontamination and cleaning processes
摘要 An effective copper decontamination method in the fabrication of integrated circuits is achieved. An organic-based HFACAC decontamination compound in vapor phase is sprayed over elemental copper found on equipment or tools or as a spill wherein the compound reacts with all of the elemental copper and forms a volatile compound that can be flushed away thereby completing copper decontamination.
申请公布号 US6261955(B1) 申请公布日期 2001.07.17
申请号 US20000618262 申请日期 2000.07.18
申请人 CHARTERED SEMICONDUCTOR MANUFACTURING LTD. 发明人 ALIYU YAKUB;CHOOI SIMON;ZHOU MEI SHENG;SUDIJONO JOHN LEONARD;GUPTA SUBHASH;ROY SUDIPTO RANENDRA;HO PAUL KWOK KEUNG;XU YI
分类号 C23F1/12;H01L21/306;(IPC1-7):H01L21/44 主分类号 C23F1/12
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