发明名称 |
Application of vapor phase HFACAC-based compound for use in copper decontamination and cleaning processes |
摘要 |
An effective copper decontamination method in the fabrication of integrated circuits is achieved. An organic-based HFACAC decontamination compound in vapor phase is sprayed over elemental copper found on equipment or tools or as a spill wherein the compound reacts with all of the elemental copper and forms a volatile compound that can be flushed away thereby completing copper decontamination.
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申请公布号 |
US6261955(B1) |
申请公布日期 |
2001.07.17 |
申请号 |
US20000618262 |
申请日期 |
2000.07.18 |
申请人 |
CHARTERED SEMICONDUCTOR MANUFACTURING LTD. |
发明人 |
ALIYU YAKUB;CHOOI SIMON;ZHOU MEI SHENG;SUDIJONO JOHN LEONARD;GUPTA SUBHASH;ROY SUDIPTO RANENDRA;HO PAUL KWOK KEUNG;XU YI |
分类号 |
C23F1/12;H01L21/306;(IPC1-7):H01L21/44 |
主分类号 |
C23F1/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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