| 发明名称 |
METHOD FOR IMPROVING ELECTROPLATING FILL |
| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for filling a structure on a substrate by using an electroplating process. SOLUTION: The method for filling a structure includes the steps of: depositing a barrier layer 52 on one or more surfaces of the substrate; depositing a seed layer 58 on the barrier layer 52; removing a portion of the seed layer 58; and electrochemically depositing a metal to fill a structure. Preferably, a portion or all of the seed layer formed on the sidewall portion of the structure is removed by using an electrochemical process for peeling plating prior to the electroplating process.
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| 申请公布号 |
JP2001185553(A) |
申请公布日期 |
2001.07.06 |
| 申请号 |
JP20000305522 |
申请日期 |
2000.08.30 |
| 申请人 |
APPLIED MATERIALS INC |
发明人 |
CHEN FUSEN;XU ZHENG;DING PEIJUN;CHIN BARRY;SINHA ASHOK |
| 分类号 |
C25D7/12;H01L21/20;H01L21/28;H01L21/285;H01L21/288;H01L21/3205;H01L21/768;H01L23/52;(IPC1-7):H01L21/320 |
主分类号 |
C25D7/12 |
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