RECONFIGURAGLE MULTICHIP MODULE STACK INTERFACE

摘要

A system and apparatus provide for the packaging of electronic components as well as a monitoring system to periodically check and adjust connections between the various electronic components. A multichip module (MCM) (14) may be employed with an interposer (16) and circuit card interface (18) to comprise an electronic assembly. Each of the components in the assembly includes external electrical contacts (42) which provide for the conduction of electrical signals between the components as well as to remotely located systems. The electronics assembly further includes an actuator assembly (20) which is employed to apply a compressive force to the electronic components in a stacked configuration and to periodically measure the resistance over a feedback circuit (96) to determine that there is still a good electrical connection between the contacts. If the measured resistance is above a predetermined level, the compressive force may be increased to improve the electrical connections.