| 摘要 |
PROBLEM TO BE SOLVED: To manufacture a semiconductor package with a sapphire window having a good light permeability with a good productivity by effectively preventing the sticking of metal paste, foreign matters, or the like to a light transmission area of the sapphire window brazed to the semiconductor package. SOLUTION: In the periphery of the sapphire window 2, a recessed section or steped section 2a of a specified width is formed over the entire circumference. The recessed section or stepped section 2a is attached with a metallized layer 2b and is polished so that the surface of the metallized layer 2b may be nearly leveled with the principal plane.
|
