发明名称 Circuit board for use at high voltage
摘要 <p>In order to restrict a local concentration of an electric field in a conductor layer end portion (11a, 15a) of an insulating circuit board and increase a partial electric discharge starting voltage, thereby improving an insulating reliability of the insulating circuit board and a power semiconductor apparatus employing the same, the present invention provides a method of manufacturing a insulating circuit board comprising the step of applying a voltage between the circuit patterns of the insulating circuit board in an atmospheric or depressurized gas so as to allow the circuit board to discharge electricity, or irradiating a laser beam, thereby a projection shape of the end portion (11a, 15a) of the electrode conductor (3, 6) is melted and smoothened so as to restrict the concentration of the electric field. <IMAGE></p>
申请公布号 EP1111970(A2) 申请公布日期 2001.06.27
申请号 EP20000307630 申请日期 2000.09.04
申请人 HITACHI, LTD. 发明人 KUSUKAWA, JUNPEI;TAKEUCHI, RYOZO
分类号 H01L23/12;H01L23/00;H01L25/07;H01L25/18;H05K1/02;H05K1/03;H05K3/00;H05K3/10;H05K3/22;H05K3/24;H05K3/38;(IPC1-7):H05K1/02 主分类号 H01L23/12
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