| 摘要 |
<p>PROBLEM TO BE SOLVED: To prevent an electrostatic breakdown from occurring in a semiconductor chip in a package when storing or mounting the package even without providing any static electricity protection circuit in an integrated circuit. SOLUTION: All terminals (solder balls) 2 of a BGA package 1 are connected in a net by linear solder 3. Since all the terminals 2 are connected by the solder 3 immediately before packaging to a printed-wiring board, the area among all the terminals 2 is short-circuited. Therefore, even if a high voltage due to static electricity is applied between the terminals 2 of the package 1, the voltage is not applied into the circuit of a semiconductor chip. When the area among the terminals 2 is to be mounted to a printed-wiring board by soldering, the linear solder 3 for connecting the terminals 2 is melted by heat, thus cutting the area among all the terminals 2 and hence preventing the operation of the semiconductor chip after mounting from being interfered.</p> |
