| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a semiconductor device, with which heat radiation is improved and a dispersion in positions of packaged semiconductor chips is suppressed, concerning the semiconductor device having a configuration sandwiching both sides of a semiconductor chip with heat radiating members. SOLUTION: A projecting part 6 of a first heat radiating member 3 is bonded with the main electrodes of Si chips 1a and 1b on one side 5a through a solder 2 and the Si chips 1a and 1b are fitted and bonded to a recessed part 8 of a second heat radiating member 4 through the solder 2. Besides, in the state of engaging a spacer 13 to a protruding part 7a of the first heat radiating member 3, protruding parts 7a and 7b formed on the first and second heat radiating members 3 and 4 and protruded on the side of the Si chips 1a and 1b are fitted and caulked to hoes 12a and 12b formed on a lead frame 9.</p> |
