发明名称 APPARATUS AND METHOD FOR TEXTURE ANALYSIS ON SEMICONDUCTOR WAFERS
摘要 <p>A system for performing rapid, high-resolution polycrystalline crystallographic texture analysis, by calculating an Orientation Distribution Function (ODF) from partial pole figures obtained from x-ray diffraction measurements on large samples, e.g., 200 millimeter diameter wafers. The measurement apparatus includes a 2-D area x-ray detector (60) and a collimated x-ray source (55) arranged in a specific, fixed spatial relationship dependent on the properties of the samples to be measured, and also includes a particular wafer motion assembly. The system employs a texture analysis protocol to determine ODF from the severely truncated pole figures thus obtained, through comparison of experimental ODF figures with calculated ones. The resulting system is fast, accurate, amenable to automation, and does not require highly skilled personnel to operate.</p>
申请公布号 WO0109925(A3) 申请公布日期 2001.05.31
申请号 WO2000US20653 申请日期 2000.07.28
申请人 HYPERNEX, INC. 发明人 KURTZ, DAVID, S.;KOZACZEK, KRZYSZTOF, J.;MORAN, PAUL, R.
分类号 G01N23/20;G21K1/06;H01L21/66;(IPC1-7):G01N23/20 主分类号 G01N23/20
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