| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat-radiating metallic member, whereby the amount of warpage in bonding a package body can be reduced, and a package for electronic component that satisfactorily radiates out wardly the heat generated during operation of the electronic comperation. SOLUTION: A copper-tungsten plate 11 has a thermal expansion coefficient, ranging from 7.5×10-6 or more to 8.5×10-6 or smaller and a copper content ranging from 7 wt.% or more to 13 wt.% or less. Thus, the amount of warpage of a heat-radiating metal plate 10 is reduced, when a package body 20 is bonded to the upper surface of the plate 10. As a result, when heat-radiating fins 60 are attached to the lower surface of the plate 10, adhesion between the plate 10 and the fins 60 is improved. Therefore, even if a semiconductor device 30 is mounted fixedly on a semiconductor device mounting section 31, heat resistance between the device 30 and the fins 60 is reduced, whereby heat generated during the operation of the device 30 is radiated satisfactorily to the outside, and hence the device 30 can be operated normally and stably over a long period of time. |
