发明名称 Infrared chopper using binary diffractive optics
摘要 A chopper and method of making same, the chopper being fabricated by initially generating a photomask in conjunction with software. The software provides the lens design to be finally stamped onto the chopper element. A silicon wafer is then etched by reactive ion etching using the photomask to provide the pattern and resulting in a silicon wafer master of the chopper pattern with regions in the shape oflenslets to be formed of desired dimension. The chopper pattern on the silicon wafer is then replicated with a hard material which can be easily stripped from the silicon wafer without damaging either the wafer or the hard material, preferably deposited nickel. The separated nickel replication is then used in conjunction with a heavy press to stamp out sheets of an infrared transmissive flexible film, preferably polyethylene, with the lens pattern in the replication The film with the lens pattern thereon is the chopper element.The system is designed to operate in the 8 to 13.5 micron range. While the software is designed for an individual lens, each lens is preferably in the shape of a hexagon with a plurality of such hexagons positioned on the film in a predetermined pattern, preferably that of an involute or spiral. The chopper is designed for rotation about its central axis.
申请公布号 US6232044(B1) 申请公布日期 2001.05.15
申请号 US19930159879 申请日期 1993.11.30
申请人 RAYTHEON COMPANY 发明人 GIBBONS ROBERT C.;MCKENNEY SAMUEL R.;BABER S. CHARLES;CHANG RICHARD R.;BELL MICHAEL C.
分类号 G01J1/02;G01J1/04;G01J5/62;G02B5/18;G02B26/04;(IPC1-7):B29D11/00;G02B5/02 主分类号 G01J1/02
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