发明名称 Heat sink for electronic elements has base with vertical pillars in which air flows around pillars
摘要 The heat sink used with electronic components has a base (12) from which project a series of pillars (20). The pillars are typically of a circular cross section and provide a large heat dissipation area. The base is mounted on a flange plate (28).
申请公布号 DE10043014(A1) 申请公布日期 2001.04.12
申请号 DE2000143014 申请日期 2000.09.01
申请人 SCHNEIDER-CLAUSS GMBH & CO. KG METALLWARENFABRIKATION 发明人
分类号 H01L23/367;H01L23/373;(IPC1-7):H01L23/36;H01L23/467;H01L23/40;H05K7/20 主分类号 H01L23/367
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