发明名称 |
Heat sink for electronic elements has base with vertical pillars in which air flows around pillars |
摘要 |
The heat sink used with electronic components has a base (12) from which project a series of pillars (20). The pillars are typically of a circular cross section and provide a large heat dissipation area. The base is mounted on a flange plate (28).
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申请公布号 |
DE10043014(A1) |
申请公布日期 |
2001.04.12 |
申请号 |
DE2000143014 |
申请日期 |
2000.09.01 |
申请人 |
SCHNEIDER-CLAUSS GMBH & CO. KG METALLWARENFABRIKATION |
发明人 |
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分类号 |
H01L23/367;H01L23/373;(IPC1-7):H01L23/36;H01L23/467;H01L23/40;H05K7/20 |
主分类号 |
H01L23/367 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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