| 摘要 |
PROBLEM TO BE SOLVED: To provide a copper foil with a base which has improved strength to prevent deformation, is easy in handling and moreover keeps contaminants such as a resin powder and the like from adhering on the surface of the copper foil by laminating the copper foil on a metallic base of high tenacity and to provide a method for manufacturing a copper foil laminate. SOLUTION: A copper foil with a base has a construction of a copper foil adhering to a base of a steel foil or a steel sheet. A method for manufacturing a copper foil laminate contains a step of laminating the copper foil on a pre- preg sheet by use of the copper foil with the base to obtain a laminate with the pre-preg sheet, which is employed for lamination for a printed-circuit board.
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