| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate for electronic circuit to be used for packaging a semiconductor element capable of suppressing high-frequency noises, without additionally providing a shield or filter on a semiconductor device. SOLUTION: Concerning a substrate 1 for electronic circuit to be used for packaging the semiconductor element, the substrate 1 for electronic circuit is composed of fiber reinforced resins practically containing flat soft magnetic powders 1a. |
