| 摘要 |
PROBLEM TO BE SOLVED: To prepare a resin sheet for obtaining a low water-absorbing, highly heat-resistant metal clad laminated board, which yields a thin insulating layer when molded, has an excellent surface smoothness, has a high Tg and shows an excellent adhesion to copper foil, and to provide a metal clad laminated board and a multilayered printed wiring board prepared by using this resin sheet. SOLUTION: A laminated board is prepared by using a nonwoven fabric resin sheet which is prepared by dispersing a non-cured thermosetting resin composition particle, which essentially comprises (a) an epoxy resin, (b) polyfunctional phenols and (c) a compound having a triazine ring or an isocyanuric ring and is solid at an ordinary temperature, among inorganic fibers, and molding this product into a sheet, wherein the thermosetting resin particle and the inorganic fibers are bonded by using a curable binder resin. |
