| 摘要 |
PROBLEM TO BE SOLVED: To provide a design method of a board in which solder bonding quality can be stabilized, and a mounting board. SOLUTION: In the design of electrodes for solder bonding which are formed on a board mounting electronic components, a width dimension RW' of an electrode 6', to which an electronic component 1A' provided with a terminal 1AB having a shape where the terminal of the electronic component reaches a side surface from the front surface to is solder-bonded, is made greater than a terminal width LW'. The width dimension RW of an electrode 6, to which an electronic component 1A provided with a terminal 1Aa having a shape wherein the terminal, does not reach the side surface from the front surface is solder- bonded is made equal to a terminal width LW. Thereby a bonding part shape corresponding to a terminal shape can be ensured, and solder bonding quality can be stabilized.
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