发明名称 ICING COMPOSITION
摘要 <p>An improved icing includes at least about 10 percent by weight water, at least about 0.1 percent by weight gelling agent and at least about 5 percent by weight of a low solubility sugar, the low solubility sugar having a solubility in water of less than about 40 weight percent at 20 °C. Improved icing compositions can be formed that have a cooling shear modulus of about 1000 Pa at a temperature less than about 37.8 °C and a melting shear modulus of about 5000 Pa at a temperature greater than about 73.9 °C. The improved icing exhibits improved heat stability when the food product is reheated after freezing. The icing composition can be applied to a variety of food products including cakes and waffles. An improved waffle structure can be combined with the improved icing to form a toaster product.</p>
申请公布号 WO2001019203(A1) 申请公布日期 2001.03.22
申请号 US2000022925 申请日期 2000.08.21
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