| 摘要 |
PROBLEM TO BE SOLVED: To provide a wafer polishing head allowing easy cleaning, and capable of improving machining accuracy of a wafer. SOLUTION: This wafer polishing head 21 has a head body 12 comprising a top plate part 13 and a tube-like peripheral wall part 14, a diaphragm 15 of an elastic body stretched inside the head body 12, and a sub carrier 16 fixed on lower face of the diaphragm 15. A fluid supply mechanism 33 for supplying air and pure water W (a cleaning liquid) as fluid is connected to a fluid chamber 24 formed between the head body 12 and the diaphragm 15. The head body 12 is formed with a cleaning liquid line 23 connecting the fluid chamber 24 and a front end part of the head body 12. The cleaning liquid line 23 is provided with a valve V opened and closed by a controller 34. |
