发明名称 |
Assembly process for delicate silicon structures |
摘要 |
A method for fabrication of silicon structures is disclosed. The method includes providing an acoustic transducer having a perforated member spaced from a diaphragm. Between the perforated member and the diaphragm is a sacrificial layer. After attaching the transducer to a carrier, the sacrificial layer is removed. |
申请公布号 |
AU7881400(A) |
申请公布日期 |
2001.03.19 |
申请号 |
AU20000078814 |
申请日期 |
2000.08.16 |
申请人 |
KNOWLES ELECTRONICS, LLC. |
发明人 |
MICHAEL PEDERSEN;PETER V. LOEPPERT |
分类号 |
B81B3/00;B81B7/00;B81C1/00 |
主分类号 |
B81B3/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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