| 摘要 |
PROBLEM TO BE SOLVED: To provide a module-type semiconductor substrate cleaning system for treating lengthwise semiconductor substrates. SOLUTION: A system 11 has a plurality of cleaning modules, capable of involving megasonic tank type cleaners 15 and subsequent scrubbers 17, 19. An input module 13 receives sidewise substrates and turns them lengthwise, an output module 23 receives the lengthwise substrates and turns them sidewise, each of the modules (input, cleaning and output) has substrate supports, the substrate supports of the adjacent modules are disposed at equal spacings, these modules are connected by an overhead conveyer mechanism 31 having a plurality of substrate handlers, and these handlers are separated by the same spacings X as the substrate supports of the modules below it.
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