| 摘要 |
PROBLEM TO BE SOLVED: To eliminate gaps between die pads and a semiconductor chip by passing a composite lead frame between a pair of warpage rectifying rolls, one of which is a convex crowning roll. SOLUTION: An outside-diameter straight roll 14 is rotatably supported by bearings 16 and driven by a drive motor 19 via a drive shaft 17 and a coupling 18. Furthermore, a convex outside-diameter crowing roll 13 is supported rotatably bearings 15 so as to rotate freely. The distance between the rolls 13 and 14 is adjusted with adjusting screws 20, whereby a composite lead frame whose warpage is to be rectified is passed between these rolls 13 and 14 to rectify its warpage. |
