| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor cooling device which is small in occupied area and high in cooling efficiency by a method, wherein heat sink as a whole is brought close to the same temperature. SOLUTION: A semiconductor cooling device 1 is equipped with a heat sink board 10, provided with a metal column 2 installed in upright position at its center, and a heat radiating plate 11 is fixed to the other end of the metal column 20. Heat radiating fins are provided to the heat sink board 10 and heat radiating plate 11, and wind tunnels each demarcated with a cover 15, the heat sink plate 10, and the heat radiating fins 10a are ventilated by a cooling fan 30.
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