| 摘要 |
PROBLEM TO BE SOLVED: To obtain a personal computer for which a module, etc., mounted with a semiconductor chip, particularly, a semiconductor chip that generates heat during operation can be repaired easily and which is provided with a cooling function for the semiconductor chip and can be suitably reduced in thickness. SOLUTION: A personal computer 1 is provided with a mother board 4 having an opening (17), an MPU 5 which is faced oppositely to the opening (18) of the board 4 and has a bare chip 7 that is provided as integrated circuit parts at a position at which part of its external form is inserted into the opening (17), and a cooling fan module 12 having a cooling fan 14 which is provided at a position where the module 12 is faced oppositely to the bare chip 7 mounted on the MPU 5 for cooling the chip 7 and part of its external form is inserted into the opening (17) of the board 4. The computer 1 is also provided with stacking connectors 11 and 16 which freely detachably connect the MPU 5 to the cooling fan module 12 connected to the board 4 through the opening (17) of the board 4.
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