MULTI-CHIP MODULE FOR LEADS-ON-CHIP (LOC) ASSEMBLY AND METHOD FOR PRODUCTION OF THE SAME.

摘要

The invention relates to a multi-chip module for LOC assembly, whereby several semiconductor chips which are located on a wafer before the LOC assembly are arranged next to each other in a connecting frame. The invention also relates to a method for producing said multi-chip module. In order to keep the number of malfunctions during assembly as low as possible and to reduce the assembly time in relation to conventional assembly methods, the invention proposes to arrange part or all of the semiconductor chips located in the connecting frame on a common, continuous section of the wafer, even after the LOC assembly of the module. To achieve this, the desired arrangement of chips in the connecting frame is already obtained on the wafer and the section of wafer containing this arrangement is subsequently separated as a common, continuous section and is placed in the connecting frame.