| 摘要 |
<p>PROBLEM TO BE SOLVED: To correspond to all process needs and allow miniaturization of device, by changing incident angle of an ion beam to a treated object arbitrarily or at least in mutually different two axis directions. SOLUTION: A wafer holder 12 for holding a wafer 14 is provided with a mechanism for setting the surface of the wafer 14 to an arbitrary angle about a horizontal axis 18 (αaxis) and a vertical axis 19 (βaxis) orthogonal to an incident direction of an ion beam 15. The wafer holder 12 has theαaxis 18 parallel with a rotation central axis 13 and theβaxis 19 placed orthogonally to the rotation central axis 13, and rotates about respective axial lines. The plurality of wafer holders 12 are arranged on circumferential side surface of a column-like rotator 11, and each wafer holder 12 is connected using a link mechanism to anαangle control panel 22 and aβangle control panel 23 by which anαangle control shaft 20 for theαaxis 18 and aβangle control shaft 21 for theβaxis 19 respectively rotate.</p> |
