发明名称 |
PHOTOSENSITIVE RESIN COMPOSITION AND METHOD OF IMPROVING DRY ETCHING RESISTANCE OF PHOTOSENSITIVE RESIN COMPOSITION |
摘要 |
A method of enabling a photosensitive resin composition to give a satisfactory pattern with greatly improved dry etching resistance while retaining high sensitivity and high resolution; and a photosensitive resin composition obtained by the method. The composition comprises an alkali-soluble resin, a photosensitive material, and a fluorescent material in an amount of 0.0001 to 1.0 part by weight per 100 parts by weight of the photosensitive material, and is characterized in that the weight-average molecular weight of the alkali-soluble resin is higher by at least 5% than that of the alkali-soluble resin used in photosensitive resin compositions containing no sensitivity improver and having the same sensitivity as that photosensitive resin composition.
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申请公布号 |
WO0075728(A1) |
申请公布日期 |
2000.12.14 |
申请号 |
WO2000JP03635 |
申请日期 |
2000.06.05 |
申请人 |
CLARIANT INTERNATIONAL LTD.;TAKAHASHI, SHUICHI |
发明人 |
TAKAHASHI, SHUICHI |
分类号 |
H05K3/00;G03F7/004;G03F7/022;G03F7/023;H01L21/027;(IPC1-7):G03F7/004;G03F7/40 |
主分类号 |
H05K3/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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