发明名称 PHOTOSENSITIVE RESIN COMPOSITION AND METHOD OF IMPROVING DRY ETCHING RESISTANCE OF PHOTOSENSITIVE RESIN COMPOSITION
摘要 A method of enabling a photosensitive resin composition to give a satisfactory pattern with greatly improved dry etching resistance while retaining high sensitivity and high resolution; and a photosensitive resin composition obtained by the method. The composition comprises an alkali-soluble resin, a photosensitive material, and a fluorescent material in an amount of 0.0001 to 1.0 part by weight per 100 parts by weight of the photosensitive material, and is characterized in that the weight-average molecular weight of the alkali-soluble resin is higher by at least 5% than that of the alkali-soluble resin used in photosensitive resin compositions containing no sensitivity improver and having the same sensitivity as that photosensitive resin composition.
申请公布号 WO0075728(A1) 申请公布日期 2000.12.14
申请号 WO2000JP03635 申请日期 2000.06.05
申请人 CLARIANT INTERNATIONAL LTD.;TAKAHASHI, SHUICHI 发明人 TAKAHASHI, SHUICHI
分类号 H05K3/00;G03F7/004;G03F7/022;G03F7/023;H01L21/027;(IPC1-7):G03F7/004;G03F7/40 主分类号 H05K3/00
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