| 发明名称 |
Halogen-free epoxy resin |
| 摘要 |
Halogen-free epoxy resins that arise from the addition of an epoxy component to a phenol component with base catalysis are disclosed, whereby the molar mass can be adjusted by means of the molar ratios of the initial materials. The resulting resins can be used in the field of electronics, both as molding compounds and as circuit board materials and adhesives.
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| 申请公布号 |
US6160077(A) |
申请公布日期 |
2000.12.12 |
| 申请号 |
US19980197290 |
申请日期 |
1998.11.20 |
| 申请人 |
SIEMENS AKTIENGESELLSCHAFT |
发明人 |
BAYER, HEINER;FISCHER, WALTER;HEKELE, WILHELM;WIPFELDER, ERNST |
| 分类号 |
B29C43/18;B29K63/00;C08G59/02;C08G59/06;C08G59/62;C08G59/68;C09J163/00;G03F7/038;H01L23/14;H01L23/29;H01L23/31;(IPC1-7):C08G59/68;C08G65/10 |
主分类号 |
B29C43/18 |
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