| 摘要 |
PROBLEM TO BE SOLVED: To prevent deterioration of electrode noise characteristics and increase in consumption power due to the flow of a high-frequency current to substrate resistor without allowing the inductance component of the wire bonding to be ignored when grounding an electrode pad for grounding by the wire bonding in a semiconductor device for high frequency. SOLUTION: A capacitor C1 that resonates with an inductance component Lb with a bonding wire for grounding a pad for grounding electrode is connected in series with the inductance component Lb at the operating frequency of a high-frequency device, thus preventing a high-frequency signal to flow to the substrate resistor at an operating frequency, improving the noise characteristics of the device, and minimizing consumption power. |
