SEMICONDUCTOR WAFER HAVING COLUMNAR ELECTRODES, MANUFACTURE OF THE SAME, AND SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To obtain a semiconductor wafer having columnar electrodes, which enhances bonding reliability of the bonding of a mounting substrate by effectively relaxing thermal stress by the columnar electrodes. SOLUTION: A wiring pattern 16 is formed on an electrode-terminal forming surface of a semiconductor wafer 10 via an insulating layer 14, where one side face of the wiring pattern 16 is connected to each electrode terminal 12, while on the other side face of the wiring pattern 16, pillar-shaped electrodes 18 are formed through copper plating. A protective plated overcoat film 18 is formed on a top-end face of each pillar-shaped electrode. In this case, a semiconductor wafer with columnar electrodes is formed, wherein heat treatment is performed to reduce the hardness of the columnar electrodes formed through copper plating.