METHOD FOR MANUFACTURING CHIP TYPE ELECTRONIC COMPONENT CARRIER TAPE DEVICE

摘要

PURPOSE: A method for manufacturing a chip type electronic component carrier tape device is provided to manufacture correctly a thickness of a carrier tape by handling and applying freely a thickness of a thermoplastic adhesive from 5micrometer to 50micrometer. CONSTITUTION: A method for manufacturing a chip type electronic component carrier tape device comprises the step of: melting a thermoplastic adhesive; applying the melted thermoplastic adhesive with a thickness as much as 5 to 50micrometer on an original paper; and accumulating another original paper thereon before the adhesive is hardened. The thermoplastic adhesive is formed with a polyethylene resin as an olefin resin.