发明名称 |
Semiconductor encapsulating epoxy resin composition and semiconductor device |
摘要 |
<p>A semiconductor encapsulating epoxy resin composition is provided comprising (A) an epoxy resin, (B) a phenolic resin curing agent, (C) a molybdenum compound, (D-i) an organopolysiloxane, (D-ii) an organopolysiloxane cured product, or (D-iii) a block copolymer obtained by reacting an epoxy resin or alkenyl group-bearing epoxy resin with an organohydrogenpolysiloxane, and (E) an inorganic filler. The composition has improved moldability and solder crack resistance while exhibiting high flame retardance despite the absence of halogenated epoxy resins and antimony oxide.</p> |
申请公布号 |
EP1049152(A2) |
申请公布日期 |
2000.11.02 |
申请号 |
EP20000303511 |
申请日期 |
2000.04.26 |
申请人 |
SHIN-ETSU CHEMICAL CO., LTD. |
发明人 |
OSADA, SHOICHI;ASANO, EIICHI;INO, SHIGEKI;AOKI, TAKAYUKI;TOMIYOSHI, KAZUTOSHI;SHIOBARA, TOSHIO |
分类号 |
C08L83/07;C08L63/00;H01L23/29;(IPC1-7):H01L21/56;C08G59/40 |
主分类号 |
C08L83/07 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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