| 摘要 |
PURPOSE: An apparatus for flux adhesion of a solder ball is provided to adhere uniformly a flux on a bottom portion of a solder ball by using the flux stored in a flux storage groove of a flux pattern plate. CONSTITUTION: A lower eject pin is inserted into an inflow hole of a lower pin fixing panel to push a solder ball toward an upper direction. A plurality of the second shift cylinder is installed at a bottom portion of the lower pin fixing panel to push the lower pin fixing panel toward the upper direction. A plurality of upper eject pin is inserted into an inflow hole of an upper pin fixing panel to push the solder ball toward a lower direction. The upper eject pins is installed at an upper portion of the upper pin fixing panel to push the upper pin fixing panel toward the lower direction. A flux storage groove(72a) is formed on a flux pattern plate(70) to adhere the solder ball.
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