发明名称 EPOXY RESIN COMPOSITION FOR SULFUR HEXAFLUORIDE GAS INSULATED SWITCHING DEVICE, COATING AGENT AND GAS INSULATED SWITCHING DEVICE USING THE SAME
摘要 PROBLEM TO BE SOLVED: To obtain the subject composition stable to a decomposed gas of SF6 and having a high mechanical strength and a low permittivity by formulating an epoxy resin having specific epoxy groups with a curing agent for the epoxy resin, a spherical filler, etc., in a specified proportion. SOLUTION: This composition is obtained by including (A) one equivalent of an epoxy resin having two or more 1,2-epoxy groups based on one molecule, e.g. a bisphenol A diglycidyl ether, bisphenol F diglycidyl ether and an alicyclic type diglycidyl ester type epoxy resins, (B) 0.7-1.0 equivalent of a curing agent for the epoxy resin, e.g. an aromatic or an alicyclic type polycarboxylic acid anhydride or a polycarboxylic acid anhydride in which rubber grains are dispersed and (C) 35-55 vol.% of a spherical filler comprising the material of, e.g. alumina, crystalline silica, fused silica, dolomite, boron nitride, aluminum nitride, aluminum fluoride and calcium fluoride or a mixture of the spherical filler with a crushed filler.
申请公布号 JP2000281880(A) 申请公布日期 2000.10.10
申请号 JP19990095003 申请日期 1999.04.01
申请人 TOSHIBA CORP 发明人 ICHIKAWA ICHIRO;NAKANO TOSHIYUKI;FUKUDA ATSUSHI;TAKEI MASAFUMI
分类号 C08L63/00;C08K3/00;C09D163/00;(IPC1-7):C08L63/00 主分类号 C08L63/00
代理机构 代理人
主权项
地址