发明名称 PRODUCTION OF METAL-PLATED WIRE ROD AND APPARATUS THEREFOR
摘要 PROBLEM TO BE SOLVED: To provide a producing method of a metal-plated wire rod, in which a plated metal thin film on the outer periphery of the wire rod ca be formed while restraining the growth of intermetallic compound in the interface between the wire rod ad the molten metal, and to provide an apparatus therefor. SOLUTION: In the producing method of the metal-plated wire rod 10, in which, when the wire rod 1 continuously traveling is dipped in a hot-dipping metal bath 3 and is drawn up from the hot dipping metal bath 3 to form the plated metal film on the outer periphery of the wire rod 1, the wire rod is drawn up through a drawing die 4. Then, the excess molten metal stuck to the outer periphery of the wire rod 1 is scraped to form the plated metal thin film on the outer periphery of the wire rod 1.
申请公布号 JP2000282205(A) 申请公布日期 2000.10.10
申请号 JP19990092098 申请日期 1999.03.31
申请人 HITACHI CABLE LTD 发明人 WASHIMI TORU;OSHIMA MASAO;NAGAI MASAHIRO;HASHIMOTO KUNIO
分类号 C23C2/02;C23C2/14;C23C2/38;(IPC1-7):C23C2/14 主分类号 C23C2/02
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